Development of Empirical Relationships to Predict Strength of Powder Metallurgically Produced Pure Aluminium and Pure Copper Diffusion Bonded Bimetallic Joints
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Authors
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Department of Mechanical Engineering, Pondicherry Engineering College, Puducherry 607 402 ,IN
A. Murugan -
Department of Mechanical Engineering, Pondicherry Engineering College, Puducherry 607 402 ,INT. Senthilvelan
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Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar, 608 002 Tamil Nadu ,INV. Balasubramanian
DOI:
https://doi.org/10.22486/iwj/2015/v48/i3/126048Keywords:
Pure Copper, Pure Aluminium, Powder Metallurgy, Diffusion Bonding, Design of Experiments, Analysis of variance and Regression Analysis.Abstract
In the present study, pure aluminium (Al) and pure copper (Cu) plates prepared by powder metallurgy (P/M) method were bonded by diffusion bonding technique. From the literature, it was identified that the predominant diffusion bonding process parameters such as bonding temperature, holding time and bonding pressure influence the shear and bonding strength of diffusion bonded joints. In this investigation an attempt was made to develop empirical relationships to predict the shear strength and bonding strength of diffusion bonded bimetallic joints of pure Cu/AI incorporating the above parameters using statistical tools such as design of experiments, analysis of variance and regression analysis. The developed empirical relationships can be used to predict the strength of Cu/AI bimetallic joints at 95% confidence level.
